Mr. Beomsoo Shin passed the Korean Patent Attorney Examination in 2018 and has been practicing as a patent attorney at LEE & MOCK IP since 2021. He handles a broad range of intellectual property matters, including domestic and international patent, utility model, and trademark applications, Office Action (OA) responses, registration procedures, and overall IP portfolio management.

Mr. Shin has represented major corporations including a global semiconductor enterprise, as well as numerous small- and medium-sized enterprises, in various intellectual property matters. His practice particularly focuses on semiconductor technologies, including DRAM, NAND Flash, HBM, logic devices, semiconductor packaging, semiconductor manufacturing processes, and fabrication equipment. In addition, he has experience in AI, UI/UX, platform and business model-related technologies, software, and service technologies, with particular strengths in claim drafting strategies that reflect user experience and service architecture. He also supports clients in securing intellectual property rights in the fields of weapon systems and military support systems. Mr. Shin also handles international patent prosecution and OA responses in major jurisdictions including the United States, Europe, China, Japan, and Taiwan, while closely collaborating with foreign associates to support his clients’ global IP strategies and portfolio development. Based on his academic background in physics, Mr. Shin possesses extensive technical understanding of semiconductor devices, fabrication processes, and metrology technologies, which enables him to effectively translate technical innovations into strong intellectual property rights. In particular, he has substantial experience in semiconductor metrology and inspection, packaging, optical proximity correction (OPC), process algorithms, manufacturing equipment, CMOS Image Sensors (CIS), memory, and DRAM technologies. He works closely with inventors to prepare patent specifications and develop strategic claim sets that accurately capture the core aspects of their inventions. Areas of Interest: AI-based technologies, semiconductor process and packaging technologies, UI/UX and platform business models, global IP strategies.